Wire bonding surface

Details Wire bonding surface Wire bonding surface

H - Electricity

01

R

H01R 13/02 (2006.01) A61N 1/362 (2006.01) B23K 31/02 (2006.01) H01M 2/30 (2006.01) H05K 3/40 (2006.01) A61N 1/375 (2006.01) H01R 4/02 (2006.01)

Patent

CA 2380126

A bonding pad for connecting an electrical energy storage device to an implantable medical device, is described. The bonding pad comprises at least two contact surfaces, one have a channel for receiving the terminal lead of the electrical energy storage device, the other being relatively planar for contact to the medical device. That way, the channel provides for increased surface area contact with the terminal lead for a more robust connection while the opposite, planar contact surface provides flexibility for contact to a lead of the medical device.

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