Wire bonds and electrical contacts of an integrated circuit...

Details Wire bonds and electrical contacts of an integrated circuit... Wire bonds and electrical contacts of an integrated circuit...

H - Electricity

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356/143

H01L 23/48 (2006.01) H01L 21/60 (2006.01) H01L 23/31 (2006.01) H01L 23/495 (2006.01) H01L 23/498 (2006.01)

Patent

CA 1300282

CHP/M-442 WIRE BONDS AND ELECTRICAL CONTACTS OF AN INTEGRATED CIRCUIT DEVICE Jon Long ABSTRACT An integrated circuit device package includes a rigid frame and flexible tape assembly having wire leads between the die attach pad, conductive lead fingers, and the I.C. chip. A dam structure prevents resin flow to ensure proper wire bonding and a wedge prevents electrical shorting. A recognition pattern enables precise wire bonding. A epoxy molding compound is interposed in cavities formed in a Kapton layer to preclude delamination.

566450

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