H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/143
H01L 23/48 (2006.01) H01L 21/60 (2006.01) H01L 23/31 (2006.01) H01L 23/495 (2006.01) H01L 23/498 (2006.01)
Patent
CA 1300282
CHP/M-442 WIRE BONDS AND ELECTRICAL CONTACTS OF AN INTEGRATED CIRCUIT DEVICE Jon Long ABSTRACT An integrated circuit device package includes a rigid frame and flexible tape assembly having wire leads between the die attach pad, conductive lead fingers, and the I.C. chip. A dam structure prevents resin flow to ensure proper wire bonding and a wedge prevents electrical shorting. A recognition pattern enables precise wire bonding. A epoxy molding compound is interposed in cavities formed in a Kapton layer to preclude delamination.
566450
Lsi Logic Corporation
Smart & Biggar
LandOfFree
Wire bonds and electrical contacts of an integrated circuit... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wire bonds and electrical contacts of an integrated circuit..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wire bonds and electrical contacts of an integrated circuit... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1272848