Wire coating composition

H - Electricity – 01 – B

Patent

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Details

H01B 3/30 (2006.01) C08K 9/04 (2006.01) C08L 23/04 (2006.01) C09D 123/04 (2006.01) H01B 3/44 (2006.01)

Patent

CA 2214653

A wire coating composition comprises 100 php (parts per hundred parts of polypropylene) polypropylene polymer or copolymer, 1 to 20 php of polyethylene wax and 100 to 200 php of magnesium hydroxide which is provided with a hydrophobic coating. The wire coating composition does not contain any halogen and is essentially free of phosphorous and phosphorous salts.

Une composition de revêtement pour un fil conducteur comprend pour 100 parties de polypropylène ou de copolymère de polypropylène: 1 à 20 parties de cire de polyéthylène et 100 à 200 parties d'hydroxyde de magnésium portant un enrobage hydrophobe. La composition de revêtement ne contient pas d'halogène et elle est sensiblement exempte de phosphore et de sels de phosphore.

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