H - Electricity
01
R
H01R 13/629 (2006.01) H01R 12/50 (2011.01)
Patent
CA 2632515
An improved approach is provided for mounting individual wires from multi-wire cables onto circuit boards. A wire comb is mounted adjacent one or more ends of the circuit board to permit a rapid yet positive way to space apart individual wires, to hold them in place; and to permit welding or soldering of the wires to the appropriate connections or the circuit board during an overmolding process.
L'invention concerne une approche améliorée permettant de monter des fils individuels à partir de câbles à fils multiples sur des cartes à circuit imprimé. Un peigne de fils est monté de manière contiguë à une ou plusieurs extrémités de la carte à circuit imprimé afin d'autoriser une manière rapide mais cependant positive d'espacer les fils individuels, de les maintenir en place et afin de permettre un brasage ou un soudage des fils sur les connexions appropriées ou sur la carte à circuit imprimé pendant un procédé de surmoulage.
Brown Steven F.
Kirshtein Philip M.
Seifert Robert V. Jr.
Avocent Corporation
Hicks & Associates
LandOfFree
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