B - Operations – Transporting – 29 – C
Patent
B - Operations, Transporting
29
C
B29C 70/82 (2006.01) G06K 19/077 (2006.01) H01L 21/48 (2006.01) H01L 23/498 (2006.01)
Patent
CA 2627193
A wire embedded bridge made by the apparatus and method disclosed by example herein may be commonly used for the formation of an RFID circuit or chip strap (42) . The process uses flexible polyester and/or other films as a base component of the bridge. A wire (24) is heated (22) and embedded into the poly sheet (18) at precise locations in a continuous process, for example, with the poly continuously moving in a machine direction (20) . The locations of the wire make chip placement onto the wire track reliable and inexpensive, preferably using heat and pressure to bond the chips (38) with the embedded wire and form a protected RFID circuit.
L'invention concerne un dispositif et un procédé permettant de former un pont intégré dans un fil métallique, qui s'utilise couramment pour former un circuit RFID ou attache de puce. Le procédé utilise du polyester flexible et/ou d'autres films comme composant de base du pont. Un fil métallique est chauffé et intégré dans la feuille de polyester en des points précis, dans un procédé continu, par exemple, la feuille se déplaçant en continu dans le sens machine. Les points du fil métallique rendent l'installation de puces sur le tracé du fil fiable et peu coûteuse, de préférence par l'application de chaleur et de pression pour lier les puces au fil intégré et former un circuit RFID protégé.
Cote Andre
Duschek Detlef
Checkpoint Systems Inc.
Gowling Lafleur Henderson Llp
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