Wire reduction device

B - Operations – Transporting – 21 – C

Patent

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Details

B21C 3/14 (2006.01) B21C 1/02 (2006.01) B21C 9/00 (2006.01) B21C 37/04 (2006.01) B21F 7/00 (2006.01) B21F 23/00 (2006.01) H01B 13/02 (2006.01) H01B 13/34 (2006.01)

Patent

CA 2467183

A device re-shapes formed wire after processes such as annealing where wire is wound on bobbins. The device includes a reservoir for containing lubricant having a first open end and a second open end. The first end of the reservoir is closed by a guide mechanism for guiding the wire into the reservoir. The second end of the reservoir is closed by a wire shaping for shaping the wire when the wire is pulled therethrough. The wire shaping mechanism reduces the cross-sectional area of the wire by no more than 24%.

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