Wire scribed circuit boards and method of manufacture

Details Wire scribed circuit boards and method of manufacture Wire scribed circuit boards and method of manufacture

H - Electricity

05

K

356/12

H05K 3/10 (2006.01) H05K 3/22 (2006.01) H05K 7/06 (2006.01) H05K 3/38 (2006.01) H05K 3/42 (2006.01)

Patent

CA 1251576

ABSTRACT This invention relates to interconnection circuit boards and processes for making and modifying interconnection circuit boards wherein adhesive is applied to a wire used in scribing a conductor pattern. The adhesive is activated to a tacky state during the wire scribing operation which forms the conductor pattern, and can thereafter be cured to permanently bond the conductors to the board surface.

514114

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