Wire scribed circuit boards and methods of their manufacture

Details Wire scribed circuit boards and methods of their manufacture Wire scribed circuit boards and methods of their manufacture

H - Electricity

05

K

356/16, 345/62

H05K 1/11 (2006.01) G02B 6/42 (2006.01) H05K 3/40 (2006.01) H05K 7/06 (2006.01) H05K 3/10 (2006.01) H05K 3/18 (2006.01) H05K 3/42 (2006.01) H05K 3/46 (2006.01)

Patent

CA 2019615

ABSTRACT The invention concerns an interconnection board for con- necting electonic, electro-optical and/or optical devices and methods of manufacturing such boards. The interconnections are formed by scribing electrically or optically conductive fila- ments to form a signal conductor layer. The interconnection board comprises a base as a support member, an signal conductor layer laminated to the base and a surface conductor layer laminated to the signal conductor layer. The interlayer connec- tions between the signal conductor layer and the surface conduc- tor layer are formed by segments of the conductive filaments of the signal conductor layer displaced from the signal conductor layer to the vicinity of surface of the interconnection board to form part of or connect with the surface conductive pattern.

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