H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 21/66 (2006.01) G01R 31/303 (2006.01) G01R 31/3185 (2006.01) H01L 23/544 (2006.01) G01R 31/28 (2006.01) G01R 31/311 (2006.01)
Patent
CA 2409435
The present invention is for an apparatus and method for the wireless testing of Integrated Circuits and wafers. The apparatus comprises a test unit external from the wafer and at least one test circuit which is fabricated on the wafer which contains the Integrated Circuit. The test unit transmits an RF signal to power the test circuit. The test circuit, comprising a variable ring oscillator, performs a series of parametric tests at the normal operating frequency of the Integrated Circuit and transmits the test results to the test unit for analysis.
La présente invention concerne un appareil et un procédé d'essai sans fil de circuits intégrés et de plaquettes. L'appareil comprend une unité d'essai à l'extérieur de la plaquette et au moins un circuit d'essai fabriqué sur la plaquette contenant le circuit intégré. L'unité d'essai transmet un signal RF pour alimenter le circuit d'essai. Le circuit d'essai qui comprend un oscillateur en anneau variable effectue une série d'essais paramétriques à la fréquence d'exploitation normale du circuit intégré et transmet les résultats d'essai à l'unité d'essai pour analyse.
Bereskin & Parr Llp/s.e.n.c.r.l.,s.r.l.
Scanimetrics Inc.
The Governors Of The University Of Alberta
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