Wiring system employing wire mat

Details Wiring system employing wire mat Wiring system employing wire mat

H - Electricity

05

K

356/22

H05K 3/00 (2006.01)

Patent

CA 1247257

ABSTRACT OF THE DISCLOSURE A method for producing a wired circuit board is disclosed in which a multilayer sheet with selectively releasable layers is provided having an adhesive layer with first and second surfaces. A first release layer is adhered to the adhesive layer first layer and is peelably removable. It has a first coefficient of adhesion between that of the adhesive layer first surface and the first layer. A second release layer is provided which is peelably removable from the adhesive layer second surface.

541306

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