Wood-based composite board and method of manufacture

B - Operations – Transporting – 32 – B

Patent

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B32B 21/10 (2006.01) B27N 3/00 (2006.01)

Patent

CA 2415929

A wood composite board or panel, such as particleboard, fiberboard, oriented strand board or waferboard and a method of producing the same. The composite board or panel comprises a plurality of wood pieces, thermoset resin to bind the wood pieces and a filler having a high thermal conductivity. Examples of such a filler include natural and synthetic graphites, metal, carbon, silicon carbide and other similar compounds and their mixtures.

Cette invention, qui a trait à une planche ou à un panneau composite à base de bois, notamment des panneaux de particules, des panneaux de fibres, des panneaux de lamelles orientées ou des panneaux de copeaux agglomérés, concerne également un procédé permettant de les produire. La planche ou le panneau composite comportent plusieurs morceaux de bois, une résine thermodurcissable liant les morceaux de bois et une matière de charge à forte conductivité thermique. Au nombre de ces matières de charge, figurent les graphites naturels et synthétiques, le métal, le carbone, le carbure de silicium et d'autres composés similaires ainsi que leurs mélanges.

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