Wood composites of low formaldehyde emission

Details Wood composites of low formaldehyde emission Wood composites of low formaldehyde emission

B - Operations, Transporting

27

N

154/95, 154/107.

B27N 1/02 (2006.01) B32B 21/04 (2006.01) C08G 12/12 (2006.01) C08G 12/38 (2006.01) C09J 161/24 (2006.01)

Patent

CA 1225916

ABSTRACT A process for bonding lignocellulosic material or adhering articles to one another under heat and pressure, wherein the bonded lignocellulosic material or articles have a low emission of formaldehyde, which comprises applying a binder to said lignocellulosic material or to the articles, this binder comprising a urea-formaldehyde base resin having a ratio of formaldehyde to urea of 1.0:1-1.2:1, the base resin having essentially no free formaldehyde and the base resin when cured containing substantially more methylene groups than methylene ether groups.

431708

Affiliated with

Also associated with

Rating

Wood composites of low formaldehyde emission does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wood composites of low formaldehyde emission, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wood composites of low formaldehyde emission will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1325766