Wood preservative composition

A - Human Necessities – 01 – N

Patent

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Details

A01N 59/20 (2006.01) A01N 25/04 (2006.01) A01P 3/00 (2006.01) A01P 7/04 (2006.01) B27K 3/22 (2006.01)

Patent

CA 2714681

Disclosed is a wood preservative composition comprising micronized copper and copper-amine complex, wherein the copper component of the copper amine complex is from about 5% to about 50% by weight, based upon the total weight of copper in the composition. The copper amine complex serves to avoid wood surface 'chalking' that is otherwise attributable to the presence of micronized copper in copper-based slurries used to treat wood products. In addition, the copper-amine complex enhances the antimicrobial efficacy of the composition when used in wood treatment applications by facilitating cell wall penetration of the treated wood.

L'invention concerne une composition de protection du bois qui comporte un complexe de cuivre micronisé et de cuivre-amine, le composant de cuivre du complexe de cuivre-amine étant d'environ 5 % à environ 50 % en poids, sur la base du poids total de cuivre dans la composition. Le complexe cuivre-amine sert à éviter le "farinage" de la surface du bois, qui peut sinon être attribué à la présence de cuivre micronisé dans des suspensions à base de cuivre utilisées pour traiter des produits de bois. De plus, le complexe cuivre-amine renforce l'efficacité antimicrobienne de la composition lorsqu'elle est utilisée dans des applications de traitement du bois en facilitant la pénétration des parois de cellule du bois traité.

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