Wood waferizing apparatus

B - Operations – Transporting – 27 – C

Patent

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144/87

B27C 5/00 (2006.01) B27L 11/02 (2006.01)

Patent

CA 1144048

WOOD WAFERIZING APPARATUS ABSTRACT OF THE DISCLOSURE A rotatable carrier element has a plurality of elongate slots opening out from a work surface thereof with cutter knives projecting from the slots for slicing wafers off pieces of wood bearing against the work surface with the sides and the grain of the pieces extending substantially parallel to the work surface and the slots when the latter pass the wood. Each cutter knife forms part of a waferizing arrangement in each slot. Each waferizing arrangement includes a reactor guide in the slot positioned relative to the knife so as to be engaged by wafers cut by the knife to break the wafers longitudinally thereof into predetermined widths.

380595

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