B - Operations – Transporting – 32 – B
Patent
B - Operations, Transporting
32
B
B32B 21/02 (2006.01) B27D 1/00 (2006.01) B27N 3/00 (2006.01) B27N 3/06 (2006.01) B32B 21/13 (2006.01)
Patent
CA 2044865
ABSTRACT OF THE DISCLOSURE Disclosed is a woody board, in which a molded layer of a woody material of a wood powder or woody fibers is provided on one surface or both surfaces of a woody substrate of a molded sheet of a coniferous tree plywood or coniferous tree LVL, and a method of preparing said woody board. The woody board is prepared by molding a woody material mix comprising an adhesive and a woody material of a wood powder or woody fibers on at least one surface of a woody substrate. The woody board has a flat and smooth surface and has a high mechanical strength and a high screw-drawing resistance. PAT 17688-1
Borden Ladner Gervais Llp
Kabushiki Kaisha Juken Sangyo (also T/a Juken Sangyo Co. Ltd.)
Nakamoto Yusho
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