Wrap-around heat-recoverable sealing article

Details Wrap-around heat-recoverable sealing article Wrap-around heat-recoverable sealing article

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B32B 1/00 (2006.01) B29C 61/06 (2006.01) B32B 7/04 (2006.01) F16L 59/14 (2006.01) H01H 85/20 (2006.01) H01R 4/72 (2006.01) H01H 85/00 (2006.01)

Patent

CA 1329113

Abstract of the Disclosure A substrate, such as a splice between two or more wires, a wire bundle or an electical component, such as a suse, diode or transistor, is enclosed and sealed using a recoverable article comprising a polymeric sheet having an involuted curled section at one end and a sealant having a melt flow index has a specified relationship to the hot modulus of polymeric sheet. In an alternate embodiment, the sealant is a gel.

594917

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