X-ray lithography mask and devices made therewith

Details X-ray lithography mask and devices made therewith X-ray lithography mask and devices made therewith

G - Physics

21

K

356/192, 358/27

G21K 1/10 (2006.01) G03F 1/14 (2006.01)

Patent

CA 2013245

X-RAY LITHOGRAPHY MASK AND DEVICES MADE THEREWITH Abstract A mask for X-ray lithography is produced by initially forming a thin layer of polycrystalline silicon on a silicon oxide containing substrate. A portion of the substrate at the periphery of the major surface opposite the silicon layer is masked. The exposed portion of the substrate is removed by an etchant that is selective for silicon oxide containing composition relative to silicon, e.g. aqueous HF. The resulting membrane of silicon on a peripheral region of silicon oxide containing composition is in tensile stress as required for lithography, but is robust. Metal, X-ray absorbing patterns are formed on the silicon by standard lithographic procedures.

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