Polyoxymethylene molding blends

C - Chemistry – Metallurgy – 08 – L

Patent

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400/4209

C08L 59/02 (2006.01) C08L 71/02 (2006.01) C08L 77/00 (2006.01)

Patent

CA 1165931

ABSTRACT OF THE DISCLOSURE A polyoxymethylene molding composition comprising an admixture which contains a small amount of poly(ethylene glycol) and a small amount of a dispersion of polyamide in a carrier resin.

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