C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/4209
C08L 59/02 (2006.01) C08L 71/02 (2006.01) C08L 77/00 (2006.01)
Patent
CA 1165931
ABSTRACT OF THE DISCLOSURE A polyoxymethylene molding composition comprising an admixture which contains a small amount of poly(ethylene glycol) and a small amount of a dispersion of polyamide in a carrier resin.
385328
E. I. Du Pont de Nemours And Company
Mccallum Brooks & Co.
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