Conductive paste

Details Conductive paste Conductive paste

H - Electricity

01

B

31/106

H01B 1/20 (2006.01) H01B 1/22 (2006.01) H01B 1/24 (2006.01) H01L 23/482 (2006.01) H05K 1/09 (2006.01)

Patent

CA 1184757

Abstract of the Disclosure An electroconductive paste comprising (a) an electroconductive filler, (b) a reactive solvent, and (c) a hardener comprising (c-1) an epoxy resin, (c-2) a latent hardener, and (c-3) an epoxy compound-dialkylamine adduct, the percent by weight of (a), (b) and (c) being 95 to 50, 1 to 20 and 4 to 30, respectively, and the weight ratio of (c-1) : (c-2) : (c-3) being 100 : 0 to 30 : 0.1 to 40. The paste is useful for bonding electronic elements to metal lead frames and/or substrates.

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