Method for selective chemical plating

C - Chemistry – Metallurgy – 23 – C

Patent

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117/61, 204/91.5

C23C 18/20 (2006.01) C08J 7/06 (2006.01) C23C 18/16 (2006.01) H05K 3/10 (2006.01) H05K 3/12 (2006.01) H05K 3/18 (2006.01) H05K 1/03 (2006.01)

Patent

CA 1296288

ABSTRACT OF THE DISCLOSURE A process of chemical plating on a formed article composed of a polyarylene sulfide or a composition comprising a polyarylene sulfide as the predominant resin component is disclosed. The method comprises irradiating a portion not to be plated of the formed article with light of a wavelength of 0.1 nm to 404 nm and then subjecting the formed article to chemical plating to plate those portions that have not been irradiated with the light. By this method, the formed article can be selectively plated.

525527

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