Method of producing printed circuits

Details Method of producing printed circuits Method of producing printed circuits

H - Electricity

05

K

356/14

H05K 3/00 (2006.01) H05K 3/06 (2006.01) H05K 3/24 (2006.01) H05K 3/10 (2006.01)

Patent

CA 1191279

METHOD OF PRODUCING PRINTED CIRCUITS ABSTRACT A method of producing a printed circuit comprising printing a plating resist onto the clean surface of a layer of electrically conductive material on at least one side of a substrate so as to leave exposed only the required track areas of the surface; electroplating over the track areas a metal alloy, preferably a palladium/nickel alloy, which will act as an etch resist for the underlying electrically conductive material, which has good solder- ability, which has a melting point higher than 250°C, and which will provide a base for gold plate; removing the plating resist; and removing the layer of electrically conductive material from the non-track areas by etching.

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