Collet for die bonding

Details Collet for die bonding Collet for die bonding

H - Electricity

01

L

356/193

H01L 21/50 (2006.01) B23K 20/10 (2006.01)

Patent

CA 1242534

COLLET FOR DIE BONDING ABSTRACT OF THE DISCLOSURE A collet is described for use in die bonding of semiconductor dies which is comprised of a shank portion and a die holder portion which has triangular side walls and is open ended.

516830

Affiliated with

Also associated with

Rating

Collet for die bonding does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Collet for die bonding, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Collet for die bonding will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1171229