Conductor compositions

Details Conductor compositions Conductor compositions

C - Chemistry, Metallurgy

22

C

75/28, 117/65

C22C 5/06 (2006.01) H01B 1/16 (2006.01) H05K 1/09 (2006.01)

Patent

CA 1192062

ASSTRACT OF THE DISCLOSURE Palladium/silver metallizations having excellent solderability and aged adhesion are obtained by suhstituting for the palladium copper and/or certain transition metals or binary metal oxides and concomitantly reducing the amount of inorganic binder.

402227

Affiliated with

Also associated with

Rating

Conductor compositions does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Conductor compositions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductor compositions will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1184073