Apparatus for cooling integrated circuit chips

Details Apparatus for cooling integrated circuit chips Apparatus for cooling integrated circuit chips

H - Electricity

01

L

356/113

H01L 23/46 (2006.01) H01L 23/473 (2006.01) H05K 7/20 (2006.01)

Patent

CA 1192317

ABSTRACT OF THE DISCLOSURE A multichip thermal conduction module has improved cooling in a housing having at least one board mounted therein including a plurality of chips on the board. A heat conducting plate is mounted in the housing adja- cent the chips. A cold plate abuts heat conducting plate and includes an inlet an outlet connected to a coolant passage formed therein for guiding a coolant through the housing. Flexible heat conductors are connected to the heat conducting plate and are urged into aligned contact with the chips for conducting heat therefrom. The flexible conductors are in fluid communication with the cold plate passage for conducting coolant adjacent the chips.

417711

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