B - Operations – Transporting – 23 – K
Patent
B - Operations, Transporting
23
K
204/109, 204/96
B23K 10/00 (2006.01)
Patent
CA 1312304
12 METHOD AND APPARATUS FOR REMOVING COATING FROM SUBSTRATE Abstract of the Disclosure In a method and apparatus for plasma stripping a polymer photoresist coating from a semiconductor substrate, positively charged species are removed from an activated gas flow before the gas flow is brought into contact with the coating to strip the coating from the substrate. The positively charged species may be removed by bringing the activated gas into contact with a grounded conducting surface to discharge the positively charged species, or by passing the activated gas through a negatively charged electrostatic filter to filter out positively charged species. The removal of positively charged species from the gas flow reduces or eliminates build up of positive charge on an outer surface of the photoresist coating so as to avoid driving mobile positively charged ions from the photoresist into the substrate, thereby avoiding contamination of the substrate. - i -
548900
Ellul Joseph Paul
Kalnitsky Alexander
Poirier Jacques Georges
Tay Sing Pin
Junkin Charles William
Nortel Networks Limited
LandOfFree
Method and apparatus for removing coating from substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for removing coating from substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for removing coating from substrate will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1195494