Wetting of low melting temperature solders by surface active...

Details Wetting of low melting temperature solders by surface active... Wetting of low melting temperature solders by surface active...

C - Chemistry, Metallurgy

22

C

148/60, 75/92, 1

C22C 11/06 (2006.01) B23K 35/26 (2006.01) C22C 11/00 (2006.01)

Patent

CA 1305616

ABSTRACT OF THE DISCLOSURE IMPROVED WETTING OF LOW MELTING TEMPERATURE SOLDERS BY SURFACE ACTIVE ADDITIONS A lead based alloy is modified by adding thereto a surfactant consisting of about 0.01 to 0.5 weight percent tellurium, about 0.01 to 0.5 weight percent selenium, about 0.01. to 0.5 weight percent selenium plus about 0.1-0.5 weight percent antimony, and mixtures thereof. The alloy is rapidly solidified by forming a melt thereof containing the surfactant addition and quenching the melt on a moving chill surface at a quenching rate of at lease about 103°C/sec. Addition of the surfactant lowers melt surface tension and thereby promotes improved wetting.

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