Electronic component cap and seal

Details Electronic component cap and seal Electronic component cap and seal

H - Electricity

01

L

356/9

H01L 23/02 (2006.01) H05K 1/18 (2006.01) H05K 5/03 (2006.01)

Patent

CA 1201213

ELECTRONIC COMPONENT CAP AND SEAL Aik Tho (Simon) Chee Wee Soon Kiat ABSTRACT A cap and seal including a central cap (20) to be positioned over an electronic component such as an inte- grated circuit chip (12), has a spaced upstanding wall or dam (22) which may be staked to the circuit board in assembly forming with the peripheral side wall (21) of the cap a channel or moat (19). Bridging means (24) extend between wall (21) and wall (22) onto which is placed a preform ring (30) of solid sealant material. Heating of the assembly, more particularly ring (30), allows melted sealant material to flow under and around bridging means (24) to form a confined seal between wall (21), wall (22) and an annular surface (29) on the circuit board surrounding cap wall (21).

449696

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