Electrical circuit package

H - Electricity – 05 – K

Patent

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347/35

H05K 1/02 (2006.01) H05K 1/18 (2006.01) H05K 5/03 (2006.01) H05K 3/28 (2006.01)

Patent

CA 1174759

ELECTRICAL CIRCUIT PACKAGE Abstract of the Disclosure An electrical circuit package is disclosed that provides an electrically insulating protection cover for an integral circuit board assembly. The package includes a flexible dielectric substrate 10. A first portion 12 of the dielectric substrate has one or more electrically conductive paths 20 located thereon and one or more electrical components 30 supported thereon and electrically connected to the conductive paths. A second portion 12 of the dielectric substrate 10 is free of any paths or electrical components. The second portion is folded over and secured to the first portion to provide a protective enclosure.

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