Silicone compositions for buried electrical splice closures

Details Silicone compositions for buried electrical splice closures Silicone compositions for buried electrical splice closures

H - Electricity

01

B

31/98

H01B 3/46 (2006.01) H02G 15/00 (2006.01)

Patent

CA 1189308

SILICONE COMPOSITIONS FOR BURIED ELECTRICAL SPLICE CLOSURES ABSTRACT A particular dielectric fluid, having a composition with a specific gravity of at least 1.02 and consisting essentially of a silicone fluid and an additive, soluble in said silicone fluid, selected from the group consisting of trimethylsilyl treated (CH3)3SiO1/2/SiO2 resin copolymer, dipropyleneglycol- dibenzoate, dixylylethane, phenylxylylethane, and a mixture of [(CH3)3Si]2O treated silica and a silica aerogel, is employed to encapsulate and insulate an electrical cable splice. The same particular dielectric fluid composition is also used to fill an electrical cable's conductor interstices.

409835

Affiliated with

Also associated with

Rating

Silicone compositions for buried electrical splice closures does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Silicone compositions for buried electrical splice closures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Silicone compositions for buried electrical splice closures will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1204416