Preparing substrate surface for electroless plating and...

Details Preparing substrate surface for electroless plating and... Preparing substrate surface for electroless plating and...

C - Chemistry, Metallurgy

23

C

117/77

C23C 3/02 (1980.01)

Patent

CA 1176118

Case 830716 ELECTROLESS PLATING PRODUCTS Abtract of the Disclosure Polyalloy catalytic coating formulations are used for preparing a metallic substrate surface to enhance sub- sequent plating thereover of nickel, cobalt or polyalloys including nickel or cobalt. At the same time, these cata- lytic formulations can be rinsed subsequent to their ap- plication onto the substrate and prior to the electroless deposition thereover. Improved products such as printed wiring boards may be made with these catalytic formulations. Such boards are prepared by depositing metal and forming circuitry patterns by using resists, etching techniques and the like which typically leave copper specks on the non-conductive board. The invention discourages electroless deposition by a nickel-containing plating bath over embedded copper specks, thereby reducing the possibility of developing bridging within the circuitry and in general undesirably increasing the conductivity of the board at locations other than on the circuitry pattern to produce printed wiring boards that are extremely resistant to developing short circuiting problems.

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