Reduction atmosphere workpiece joining

Details Reduction atmosphere workpiece joining Reduction atmosphere workpiece joining

H - Electricity

05

K

356/5

H05K 3/34 (2006.01) B23K 35/36 (2006.01) B23K 35/38 (2006.01)

Patent

CA 1241452

REDUCTION ATMOSPHERE WORKPIECE JOINING ABSTRACT A workpiece is joined to a substrate by employing solder and applying diol and/or polyol and/or ether derivative thereof to the substrate. The workpiece is placed in contact with the diol and/or polyol and the resulting assembly is heated in a reducing atmosphere.

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