Polyamide resin compositions

Details Polyamide resin compositions Polyamide resin compositions

C - Chemistry, Metallurgy

08

K

400/7801, 400/78

C08K 5/11 (2006.01) C08K 5/098 (2006.01) C08K 7/14 (2006.01)

Patent

CA 1337777

Disclosed is a polyamide resin composition which comprises: (A) an aromatic polyamide resin consisting essentially of (a) a dicarboxylic acid component which consists essentially of 40 - 100 mole % of a terephthalic acid and 60 - 0 mole % of an aromatic dicarboxylic acid other than terephthalic acid or an aliphatic dicarboxylic acid and (b) a diamine component of an aliphatic diamine and/or an alicyclic diamine; (B) a fibrous reinforcement; and (C) at least one additive selected from the group consisting of an acid ester, a partially saponified ester and a metal salt of an aliphatic carboxylic acid of 26 - 32 carbons. The resin composition has high fluidity and mold- releasing properties as well as of high heat resistance and rigidity, so that the composition can be molded without decomposition of the resins.

612253

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