Method for processing plastic packaged electronic devices

Details Method for processing plastic packaged electronic devices Method for processing plastic packaged electronic devices

H - Electricity

01

L

356/143

H01L 23/28 (2006.01) H01L 21/56 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1297209

METHOD FOR PROCESSING PLASTIC PACKAGED EKECTRONIC DEVICES Abstract of the Disclosure The subject invention is a method for processing a plastic packaged electronic device with soldered leads. The solder has a critical temperature which if exceeded more than once results in its oxidation. The method comprises protecting the device with a carrier, and baking the device and carrier in a low pressure environment and at a temperature sufficiently high enough to drive off moisture previously absorbed by the plastic but lower than the critical temperature of the solder.

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