H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/143, 356/187
H01L 23/28 (2006.01) B29C 43/20 (2006.01) H01L 21/00 (2006.01) H01L 21/50 (2006.01) H01L 21/56 (2006.01) H01L 23/057 (2006.01) H01L 23/60 (2006.01)
Patent
CA 1237825
ABSTRACT OF THE DISCLOSURE Encapsulated electronic circuit devices as well as methods and molding apparatus for making same are disclosed. For example, an integrated circuit "die" (or "chip") and the lead frame (or frames) to which it is physically affixed and electrically connected are positioned in a mold between stacks of resin impregnated fibrous layers of predetermined shape and size. The layers are then compressed under heat and pressure causing them to fuse together about the die and its lead frame(s). This forms a laminated protective sealed encapsulation for the die and adjacent portions of the lead frame(s), without causing undue damage to the delicate lead wires electrically connecting the die to the lead frame. Such multiple laminated layers of resin and fibers, which preferably include woven glass cloth or similar materials, provide a strong, resilient integrated circuit chip "carrier" (of either the "leaded" or "leadless" variety) which may conveniently include multiple lead frames, heat conductive members, strengthening members and the like. A window may be provided in the layers to provide a space for the chip. Also, metallic layers may also be provided to enhance performance of the package.
482227
Baker Harold C.
Ross Milton I.
LandOfFree
Plastic resin and fibre encapsulation of electronic circuit... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Plastic resin and fibre encapsulation of electronic circuit..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plastic resin and fibre encapsulation of electronic circuit... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1214270