H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/16
H05K 1/02 (2006.01) H01L 23/538 (2006.01)
Patent
CA 1226374
ABSTRACT OF THE DISCLOSURE A multilayer wiring substrate is described. It includes a first power supply wiring layer group having first power supply wiring layers for supplying different voltages, respectively, and first insulating layers for insulating the wiring layers from each other. A second power supply wiring layer group has second power supply wiring layers, each being in one-to-one correspondence to the first power supply wiring layers, and second insulating layers for insulating the second power supply wiring layers from each other. Also provided are first via-hole wirings for connecting each of the first power supply wiring layers and a corresponding one of the second power supply wiring layers. Terminals are provided on the bottom surface of the second power supply wiring layer group. Second via-hole wirings are provided for connecting the terminals to the power supply wiring layers. A signal wiring layer section has thin film signal wiring layers, third insulating layers for insulating the signal wiring layers from each other, and third via-hole wirings for connecting the signal wiring layers to each other and provided on the first power supply wiring layer group. Also provided are internal wirings whose one ends are exposed on the top surface of the signal wiring layer section and whose other ends are connected to the first power supply wiring layers.
489481
Corporation Nec
Smart & Biggar
LandOfFree
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