Solder finishing integrated circuit package leads

Details Solder finishing integrated circuit package leads Solder finishing integrated circuit package leads

B - Operations, Transporting

05

D

356/146, 356/187

B05D 5/12 (2006.01) B23K 1/08 (2006.01) H01L 21/48 (2006.01)

Patent

CA 1247753

SOLDER FINISHING INTEGRATED CIRCUIT PACKAGE LEADS Abstract A new method for solder finishing the leads of an integrated circuit package (22) such as a DIP having two parallel rows of leads along the sides of the package. The method contemplates establishing two vertical columns (56,58) of falling molten solder and spacing the columns apart a distance substantially the width of the package. The package (22) is passed between the vertical columns (56,58) of falling molten solder immersing the two parallel rows of leads along the sides of the package in the respective columns of molten solder, washing the leads and depositing a finishing layer of solder over the surfaces of the leads. The method further contemplates directing hot nonreacting gas over the leads of the package as the package passes from the columns thereby eliminating excess solder and bridging of solder between the leads. A monorail track system and a new solder bridge for implementing the method are described. The invention may be applied for column fluxing as well as for other column liquid treatments.

540461

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