C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
400/4112
C08G 18/10 (2006.01) B32B 15/08 (2006.01) C08G 18/32 (2006.01) C08G 18/58 (2006.01) C08G 18/61 (2006.01) C08G 77/458 (2006.01) C09J 175/04 (2006.01)
Patent
CA 1301981
ABSTRACT OF THE DISCLOSURE A method for making a one package heat curable (i.e. thermosetting) composition which, on heating, forms a urethane/epoxy/silicone interpenetrating polymer network (IPN) system; one package heat curable compositions made by such a method; metal reinforcing patches, directly adherent to an oily metal surface such as an oily steel surface, comprising a sheet-like carrier having thereon such a one package heat curable composition in combination with a filler admixed therewith, said filler possibly including magnetic particles; a method for reinforcing metal which comprises applying thereto such a metal reinforcing patch and curing said heat curable composition at an elevated temperature to form a urethane/epoxy/silicone interpenetrating polymer network.
528152
Rizk Sidky D.
Shah Navinchandra B.
Essex Specialty Products Inc.
Swabey Ogilvy Renault
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