B - Operations – Transporting – 29 – C
Patent
B - Operations, Transporting
29
C
18/1102
B29C 39/20 (2006.01) B29C 37/00 (2006.01) B29C 70/64 (2006.01) B32B 7/08 (2006.01) F04D 29/42 (2006.01)
Patent
CA 1208407
ABSTRACT Joining together two materials by a mechanical interlock resulting from "chips" at their interface is disclosed. The chips, composed of one of the two materials to be joined or of a third material are partially embedded into the surface of the first material when that material is formed so as to form surfaces which "overhang" the first material. Thereafter, the second material is formed against the overhanging surfaces of the chips to establish the mechanical interlock. This technique is particularly use- ful in anchoring a dissimilar material to a polymeric material having poor bondability and/or a high melt temper- ature, for example fluoropolymers, as illustrated by the forming of a liner for a pump casing, or the like, by rotational molding. In that illustration, small particles and chips are distributed uniformly over the surface of an enclosed mold heated to melt the particles and fuse the chips thereto, and cooled to form a layer with the chips projecting therefrom so as to provide an interlock when a casing is formed against the liner. Other aspects of the present invention include the article of manufacture formed by the above method.
481372
Flowserve Corporation
Smart & Biggar
LandOfFree
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