Curable molding compositions

Details Curable molding compositions Curable molding compositions

C - Chemistry, Metallurgy

08

F

402/1, 400/5053,

C08F 299/00 (2006.01) C08F 4/00 (2006.01) C08F 220/00 (2006.01) C08F 290/14 (2006.01) C08F 299/04 (2006.01) C08L 101/00 (2006.01)

Patent

CA 1186098

ABSTRACT OF THE DISCLOSURE Described herein are curable molding compositions used for the rapid production of fiber-reinforced thermoset resin articles having improved mechanical properties, which composition comprises: (a) a thermosettable organic material containing two or more polymerizable carbon-carbon double bonds, (b) an ethylenically unsaturated monomer which forms a liquid homogeneous mixture with and is copolymerizable with (a) and is different from (a), and (c) an effective amount of an initiator or a mixture of initiators characterized by a ten-hour half life temperature, or in the case of a mixture of initiators, an average ten-half hour life temperature, of greater than about 50°C and less than 105°C, which produces on decomposition less than 1.0 milliliter of gas per gram of resin as measured at a temperature of 25°C and a pressure of one atmosphere.

405446

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