Epoxy resin containing a combination of high and low...

Details Epoxy resin containing a combination of high and low... Epoxy resin containing a combination of high and low...

C - Chemistry, Metallurgy

08

G

402/254

C08G 59/50 (2006.01) C08L 63/00 (2006.01)

Patent

CA 1231796

EPOXY RESIN CONTAINING A COMBINATION OF HIGH AND LOW MOLECULAR WEIGHT POLYOXYALKYLENE POLYAMIME CURING AGENTS ABSTRACT OF THE DISCLOSURE The adhesion properties of amine cured epoxy resins are unexpectedly enhanced by addition of a certain combination of high and low molecular weight polyoxyalkylene polyamines. The adhesively superior epoxy resin composition comprises a vicinal polyepoxide, a curing amount of a combination of about 85 wt.% or more of certain polyoxyalkylene polyamines having a molecular weight of less than about 450 and 15 wt.% or less of a polyoxyalkylene polyamine of greater than two primary amine functionality and a molecular weight of about 5,000 and above.

472006

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