Method of preserving the solderability of copper

Details Method of preserving the solderability of copper Method of preserving the solderability of copper

C - Chemistry, Metallurgy

23

C

148/17

C23C 22/83 (2006.01) C23F 11/14 (2006.01) H05K 3/28 (2006.01)

Patent

CA 1193523

- 12 - METHOD OF PRESERVING THE SOLDERABILITY OF COPPER Abstract of the Disclosure This invention relates to a method for preserving the solderability of copper conductors by stabilizing a cleaned, mildly etched conductor surface with a phosphoric acid - glycol solution then immersing the surface in imidazole followed by a rinse to remove excess imidazole.

406160

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