Thermally stable capped thermoplastic phenolic resin

C - Chemistry – Metallurgy – 08 – G

Patent

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Details

402/252, 400/790

C08G 59/62 (2006.01) C08G 65/28 (2006.01) C09D 3/49 (1985.01)

Patent

CA 1261534

ABSTRACT A heat stable thermoplastic phenolic resin is prepared by (I) reacting (A) the reaction product of (1) at least one epoxy resin having an average of more than one vicinal epoxy group per molecule such as a diglycidyl ether of bisphenol A with (2) one or more polyhydric phenols such as bisphenol A; and optionally (B) one or more polyhydric phenols such as bisphenol A; with (II) a material having only one vicinal epoxy group per molecule such as the glycidyl ether of t-butyl phenol or mixture of such materials; in the presence of an effective quantity of a suitable catalyst such as ethyltriphenylphosphonium acetate-acetic acid complex. The present resin exhibits a much reduced viscosity increase at elevated temperatures as compared with a conventional resin, and is preferably used for paint formulations for highway pavement.

518143

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