Apparatus and method for compensation of thermal expansion...

Details Apparatus and method for compensation of thermal expansion... Apparatus and method for compensation of thermal expansion...

H - Electricity

05

K

347/4

H05K 7/20 (2006.01) H01L 23/473 (2006.01)

Patent

CA 1290437

ABSTRACT In an electronic package in which a fluid is encased to provide efficient thermal transfer between electronic components and cooling plate, the thermal expansion of the cooling fluid is compensated for by tubing in the enclosure. The tubing is vented to the atmosphere and as the cooling fluid expands, the tubing is compressed. The tubing is generally coiled within the chamber and can have a kink in the center region, dividing the tubing into two portions. Both portions of the tubing are vented to the external environment. In the preferred embodiment, surgical tubing is employed to compensate for the thermally induced changes in volume.

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