Process for obtaining electrical interconnect using a...

Details Process for obtaining electrical interconnect using a... Process for obtaining electrical interconnect using a...

H - Electricity

05

K

356/11, 339/11.6

H05K 3/42 (2006.01) H05K 3/40 (2006.01)

Patent

CA 1295426

Abstract A method for providing an electrical connection (via) between the top and bottom of a printed circuit board (PCB) is presented. An eyelet extends through a hole in the PCB. The top Or the PCB has a first conductive layer. Around the hole the first conductive layer is shaped such that a conductive pad is isolated from the rest of the first conductive layer, except that spokes of the first conductive layer extend from the conductive pad to the reset of the first conductive layer. The eyelet is crimped such that crimped fingers or tabs of the eyelet cause the eyelet to be mechanically retained in the hole. The tabs are curved so that the tabs do not lie flat upon the conductive pad. The bottom Or the PCB is then wave soldered so that a base of the eyelet is electrically coupled to a conductive layer on the bottom of the PCB and the tabs are electrically coupled to the conductive pad.

592015

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