Process for the photoselective metallization on non-...

Details Process for the photoselective metallization on non-... Process for the photoselective metallization on non-...

G - Physics

03

F

96/252

G03F 7/26 (2006.01) C23C 18/16 (2006.01) H05K 3/18 (2006.01)

Patent

CA 1265698

UNITED STATES PATENT APPLICATION OF DAVID C. FRISCH AND WILHELM WEBER FOR PROCESS FOR THE PHOTOSELECTIVE METALLIZATION ON NON-CONDUCTIVE PLASTIC BASE MATERIALS ABSTRACT Catalytically imaged thermosetting and thermoplastic resin objects including printed circuit boards are provided. A hydrophilic, adhesion promoted insulating base material is treated in selected areas to produce metallic nuclei in the form of an image of a desired metal pattern. The image is exposed to an electroless metal bath to reinforce the image. Then, the non-imaged areas of the base are rendered hydrophobic by means of solvent treatment. The imaged areas are built up by metal deposition. Preferably, the solvent treatment of the non-imaged areas of the base material is repeated to enhance adhesion of the metal pattern to the base materiel.

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