Adhesive composition useful for connecting two electrically...

H - Electricity – 01 – L

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154/107, 31/154,

H01L 23/28 (2006.01) H05K 3/30 (2006.01)

Patent

CA 1282520

ABSTRACT Disclosed is an adhesive for connecting a circuit member having a plurality of laterally spaced conductive terminals to a substrate including a mounting surface having a plurality of laterally spaced conductive paths, said adhesive comprising a mixture of a dielectric polymeric resin and twenty to twenty-five percent by weight of spaced pure conductive metal or metal alloy particles uniformly suspended in said resin as a resin/metal suspension wherein said resin prevents conductivity between said spaced metal particles, said adhesive being characterized by said resin being nonconductive as said resin/metal suspension and being conductive when concentrated to forty to fifty percent by weight of said particles to decrease the spacing between said metal particles allowing conductivity through said resin.

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