Short-pulse soldering system

Details Short-pulse soldering system Short-pulse soldering system

H - Electricity

05

K

356/22, 327/84

H05K 3/34 (2006.01) H05K 13/06 (2006.01)

Patent

CA 1202377

ABSTRACT A system for rapidly soldering wire to terminal pads of a printed circuit board. A soldering tool is heated to a high temperature above 1000 degrees F., and preferably between 1600 to 2000 degrees F., and has a predetermined effective mass for holding a quantum of heat just sufficient to make an effective solder joint over a broad range of terminal pad conditions.

427813

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