H - Electricity – 01 – R
Patent
H - Electricity
01
R
113/87
H01R 43/02 (2006.01) B23K 3/06 (2006.01) B23K 20/04 (2006.01) H05K 3/34 (2006.01) H01R 4/02 (2006.01) H01R 43/16 (2006.01)
Patent
CA 1204027
TITLE SOLDER BONDING PROCESS ABSTRACT OF THE DISCLOSURE Process for locating solder on a precalculated position on an electrical terminal. Metal strip stock coated with a thin layer of solder is fed through a strip guide for precisely positioning the metal strip stock between a pair of rollers. A solder wire is cold bonded to the metal strip stock and the strip stock is subsequently stamped into a terminal.
420207
E. I. Du Pont de Nemours And Company
Mccallum Brooks & Co.
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