H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/1
H05K 3/38 (2006.01) H05K 3/10 (2006.01) H05K 1/00 (2006.01) H05K 3/02 (2006.01)
Patent
CA 1263763
Abstract This invention relates to presensitized circuit material. Currently, the inner layers of multilayer printed circuit boards and flexible printed circuits are manufactured by subtractive etching of large sheets of photoresist-imaged copper clad laminate. This process is costly because of copper waste and problems relating to environmental pollution. Moreover, the circuits resulting from the process are limited by the properties of the laminate and the imaging materials used. Thus, there is a desire in the electronics industry to employ additive electroplating processes whenever possible. This invention provides an article suitable as a presensitized circuit material comprising (1) an electrically insulative support, (2) a thin adhesion layer made of a conductive metal overlying said support, (3) a thin metallic plating layer overlying said adhesion layer, and (4) a photoresist layer overlying said plating layer. The preferred metal for the adhesion layer is an alloy of chromium and chromium oxide, i.e., black-chromium. The adhesion layer helps to provide an electrical circuit which tenaciously adheres to the electrically insulative support. This article is particularly useful in additive electroplating processes.
537885
Minnesota Mining And Manufacturing Company
Smart & Biggar
LandOfFree
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