H - Electricity – 02 – K
Patent
H - Electricity
02
K
310/36
H02K 7/14 (2006.01) G03F 7/20 (2006.01) G05D 3/12 (2006.01) H02K 41/02 (2006.01)
Patent
CA 1216876
Abstract of the Disclosure This invention is directed to electro- magnetic alignment devices, which are particularly adapted, among other possible uses, for use in aligning the wafers in a microlithography system, said devices comprising in combination a base plate, a first current carrying coil assembly mounted on the base plate, a second current carrying coil assembly mounted on the base plate in spaced relationship with respect to the first coil assembly, a first magnet mounted adjacent the first coil assembly and a second magnet mounted adjacent the second coil assembly, an upper connecting piece connecting the first and second magnets, a mount for receiving an object on the upper connecting piece, the base plate and magnets and upper connecting piece coating to form a magnetic circuit, a controller for controlling the flow and direction of current through the coil assemblies to move the magnets and upper connecting piece with respect to the base plate, a plurality of linear actuators mounted between the magnets and the upper connecting piece respectively for moving the connecting piece with respect to the magnets.
453577
Osler Hoskin & Harcourt Llp
Perkin-Elmer Corporation The
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